Plasma Etching Processes For Cmos Devices Realization
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Plasma Etching Processes for CMOS Devices Realization
Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent. Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography. This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization. - Helps readers discover the master technology used to pattern complex structures involving various materials - Explores the capabilities of cold plasmas to generate well controlled etched profiles and high etch selectivities between materials - Teaches users how etch compensation helps to create devices that are smaller than 20 nm
Miniaturized Transistors
What is the future of CMOS? Sustaining increased transistor densities along the path of Moore's Law has become increasingly challenging with limited power budgets, interconnect bandwidths, and fabrication capabilities. In the last decade alone, transistors have undergone significant design makeovers; from planar transistors of ten years ago, technological advancements have accelerated to today's FinFETs, which hardly resemble their bulky ancestors. FinFETs could potentially take us to the 5-nm node, but what comes after it? From gate-all-around devices to single electron transistors and two-dimensional semiconductors, a torrent of research is being carried out in order to design the next transistor generation, engineer the optimal materials, improve the fabrication technology, and properly model future devices. We invite insight from investigators and scientists in the field to showcase their work in this Special Issue with research papers, short communications, and review articles that focus on trends in micro- and nanotechnology from fundamental research to applications.
Progress in Adhesion and Adhesives, Volume 9
The present book constitutes Volume 9 in the book series Progress in Adhesion and Adhesives which was conceived as an annual publication and the premier volume made its debut in 2015. These volumes provide state-of-the-knowledge and curated reviews on many and varied topics about adhesion and adhesives. The current book contains 14 chapters that include the use of hydrophobic and icephobic coatings for aircraft icing mitigations; fundamental concepts and the application of hydrophobic coatings; plasma treatment of polymers to enhance their adhesion; atmospheric pressure plasma treatment of artificial leather; sustainable plasma technology as a surface treatment in footwear materials; failure cases in adhesive joints and coatings; initiating systems for curing anaerobic adhesives; use of fungal mycelia as an adhesive in composites; mechanically responsive hydrogels as adhesives for clinical applications; and adhesion of electrode coatings in lithium-ion batteries and supercapacitors.