Physical Models For Quantum Wires Nanotubes And Nanoribbons

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Physical Models for Quantum Wires, Nanotubes, and Nanoribbons

A compilation of articles that span more than 30 years of research on developing comprehensive physical models. Address the effect of quantum confinement on lattice vibrations, carriers scattering rates, and charge transport and present practical examples of solutions to the Boltzmann equation. Topics on quantum transport and spin effects in unidimensional molecular structures such as carbon nanotubes and graphene nanoribbons.
Physical Models for Quantum Wires, Nanotubes, and Nanoribbons

Quantum wires are artificial structures characterized by nanoscale cross sections that contain charged particles moving along a single degree of freedom. With electronic motions constrained into standing modes along with the two other spatial directions, they have been primarily investigated for their unidimensional dynamics of quantum-confined charge carriers, which eventually led to broad applications in large-scale nanoelectronics. This book is a compilation of articles that span more than 30 years of research on developing comprehensive physical models that describe the physical properties of these unidimensional semiconductor structures. The articles address the effect of quantum confinement on lattice vibrations, carrier scattering rates, and charge transport as well as present practical examples of solutions to the Boltzmann equation by analytical techniques and by numerical simulations such as the Monte Carlo method. The book also presents topics on quantum transport and spin effects in unidimensional molecular structures such as carbon nanotubes and graphene nanoribbons in terms of non-equilibrium Green’s function approaches and density functional theory.
Nanopackaging

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. Now in a widely extended second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. Twelve new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.