Microelectronic Circuits Theory And Applications 7e

Electronic Circuits with MATLAB, PSpice, and Smith Chart

Provides practical examples of circuit design and analysis using PSpice, MATLAB, and the Smith Chart This book presents the three technologies used to deal with electronic circuits: MATLAB, PSpice, and Smith chart. It gives students, researchers, and practicing engineers the necessary design and modelling tools for validating electronic design concepts involving bipolar junction transistors (BJTs), field-effect transistors (FET), OP Amp circuits, and analog filters. Electronic Circuits with MATLAB®, PSpice®, and Smith Chart presents analytical solutions with the results of MATLAB analysis and PSpice simulation. This gives the reader information about the state of the art and confidence in the legitimacy of the solution, as long as the solutions obtained by using the two software tools agree with each other. For representative examples of impedance matching and filter design, the solution using MATLAB and Smith chart (Smith V4.1) are presented for comparison and crosscheck. This approach is expected to give the reader confidence in, and a deeper understanding of, the solution. In addition, this text: Increases the reader's understanding of the underlying processes and related equations for the design and analysis of circuits Provides a stepping stone to RF (radio frequency) circuit design by demonstrating how MATLAB can be used for the design and implementation of microstrip filters Features two chapters dedicated to the application of Smith charts and two-port network theory Electronic Circuits with MATLAB®, PSpice®, and Smith Chart will be of great benefit to practicing engineers and graduate students interested in circuit theory and RF circuits.

Electronic Systems and Applications

Systems-Level Packaging for Millimeter-Wave Transceivers

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.