Systems Level Packaging For Millimeter Wave Transceivers
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Systems-Level Packaging for Millimeter-Wave Transceivers
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Millimeter-Wave Integrated Circuits
This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.
Millimeter-wave Integrated Technologies in the Era of the Fourth Industrial Revolution
This peer-reviewed book explores the technologies driving broadband internet connectivity in the fourth industrial revolution (Industry 4.0). It particularly focuses on potential solutions to introduce these technologies in emerging markets and rural areas, regions that typically form part of the digital divide and often have under-developed telecommunications infrastructures, a lack of skilled workers, and geographical restrictions that limit broadband connectivity. Research shows that ubiquitous internet access boosts socio-economic growth through innovations in science and technology, with the common goal of bringing positive change to the lives of individuals. Fifth-generation (5G) networks based on millimeter-wave (mm-wave) frequency information transfer have the potential to provide future-proof, affordable and sustainable broadband connectivity in areas where previous-generation mobile networks were unable to do so. This book discusses the principles of various technologies that enable electronic circuits to operate at mm-wave frequencies. It examines the importance of identifying, describing, and analyzing technology from a purely technological standpoint, but also acknowledges and investigates the challenges and limitations of introducing such technologies in emerging markets. Presenting recent research, the book spearheads participation in Industry 4.0 in these areas.