High Density Integrated Electrocortical Neural Interfaces
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High-Density Integrated Electrocortical Neural Interfaces
High-Density Integrated Electrocortical Neural Interfaces provides a basic understanding, design strategies and implementation applications for electrocortical neural interfaces with a focus on integrated circuit design technologies. A wide variety of topics associated with the design and application of electrocortical neural implants are covered in this book. Written by leading experts in the field— Dr. Sohmyung Ha, Dr. Chul Kim, Dr. Patrick P. Mercier and Dr. Gert Cauwenberghs —the book discusses basic principles and practical design strategies of electrocorticography, electrode interfaces, signal acquisition, power delivery, data communication, and stimulation. In addition, an overview and critical review of the state-of-the-art research is included. These methodologies present a path towards the development of minimally invasive brain-computer interfaces capable of resolving microscale neural activity with wide-ranging coverage across the cortical surface. - Written by leading researchers in electrocorticography in brain-computer interfaces - Offers a unique focus on neural interface circuit design, from electrode to interface, circuit, powering, communication and encapsulation - Covers the newest ECoG interface systems and electrode interfaces for ECoG and biopotential sensing
Body Area Networks. Smart IoT and Big Data for Intelligent Health Management
This book constitutes the refereed post-conference proceedings from the 18th EAI International Conference on Body Area Networks, BODYNETS 2024-A, held in Milan, Italy, in February 5-6, 2024. The 20 full papers presented here were carefully reviewed and selected from 48 submissions. These papers have been organized in the following topical sections: Implantable devices and In-body communication; Body area networks and transmission technologies; Smart healthcare applications; Privacy and security in wireless body area networks.
Neural Engineering
This third edition overviews the essential contemporary topics of neuroengineering, from basic principles to the state-of-the-art, and is written by leading scholars in the field. The book covers neural bioelectrical measurements and sensors, EEG signal processing, brain-computer interfaces, implantable and transcranial neuromodulation, peripheral neural interfacing, neuroimaging, neural modelling, neural circuits and system identification, retinal bioengineering and prosthetics, and neural tissue engineering. Each chapter is followed by homework questions intended for classroom use. This is an ideal textbook for students at the graduate and advanced undergraduate level as well as academics, biomedical engineers, neuroscientists, neurophysiologists, and industry professionals seeking to learn the latest developments in this emerging field. Advance Praise for Neural Engineering, 3rd Edition: “A comprehensive and timely contribution to the ever growing field of neural engineering. Bin He’s edited volume provides chapters that cover both the fundamentals and state-of-the-art developments by the world’s leading neural engineers." Dr. Paul Sajda, Department of Biomedical Engineering, Electrical Engineering and Radiology, Columbia University “Neural Engineering, edited by Prof. He, is an outstanding book for students entering into this fast evolving field as well as experienced researchers. Its didactic and comprehensive style, with each chapter authored by leading scientific authorities, provides the ultimate reference for the field.” Dr. Dario Farina, Department of Bioengineering, Imperial College London, London, UK "Neural Engineering has come of age. Major advances have made possible prosthesis for the blind, mind control for quadraplegics and direct intervention to control seizures in epilepsy patients. Neural Engineering brings together reviews by leading researchers in this flourishing field. Dr. Terrence Sejnowski, Salk Institute for Biolgical Studies and UC San Diego