Difference Between Microelectronics And Microsystems
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MEMS and Microsystems
Technology/Engineering/Mechanical A bestselling MEMS text...now better than ever. An engineering design approach to Microelectromechanical Systems, MEMS and Microsystems remains the only available text to cover both the electrical and the mechanical aspects of the technology. In the five years since the publication of the first edition, there have been significant changes in the science and technology of miniaturization, including microsystems technology and nanotechnology. In response to the increasing needs of engineers to acquire basic knowledge and experience in these areas, this popular text has been carefully updated, including an entirely new section on the introduction of nanoscale engineering. Following a brief introduction to the history and evolution of nanotechnology, the author covers the fundamentals in the engineering design of nanostructures, including fabrication techniques for producing nanoproducts, engineering design principles in molecular dynamics, and fluid flows and heat transmission in nanoscale substances. Other highlights of the Second Edition include: * Expanded coverage of microfabrication plus assembly and packaging technologies * The introduction of microgyroscopes, miniature microphones, and heat pipes * Design methodologies for thermally actuated multilayered device components * The use of popular SU-8 polymer material Supported by numerous examples, case studies, and applied problems to facilitate understanding and real-world application, the Second Edition will be of significant value for both professionals and senior-level mechanical or electrical engineering students.
Smart Sensors and MEMS
Author: Sergey Y. Yurish
language: en
Publisher: Springer Science & Business Media
Release Date: 2007-11-12
The book Smart Sensors and MEMS provides an unique collection of contributions on latest achievements in sensors area and technologies that have made by eleven internationally recognized leading experts from Czech Republic, Germany, Italy, Israel, Portugal, Switzerland, Ukraine and USA during the NATO Advanced Study Institute (ASI) in Povoa de Varzim, Portugal, from 8 to 19 September 2003. The aims of this volume are to disseminate wider and in-depth theoretical and practical knowledge about smart sensors and its applications, to create a clear consciousness about the effectiveness of MEMS technologies, advanced signal processing and conversion methods, to stimulate the theoretical and applied research in these areas, and promote the practical using of these techniques in the industry. With that in mind, a broad range of physical, chemical and biosensors design principles, technologies and applications were included in the book. It is a first attempt to describe in the same book different physical, chemical, biological sensors and MEMS technologies suitable for smart sensors creation. The book presents the state-of-the-art and gives an excellent opportunity to provide a systematic, in-depth treatment of the new and rapidly developing field of smart sensors and MEMS. The volume is an excellent guide for practicing engineers, researchers and students interested in this crucial aspect of actual smart sensor design.
Introduction to Microsystem Packaging Technology
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.