Vlsi Soc 2023 Innovations For Trustworthy Artificial Intelligence
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VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
Author: Ibrahim (Abe) M. Elfadel
language: en
Publisher: Springer Nature
Release Date: 2024-12-28
This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16–18, 2023. The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.
2023 IFIP IEEE 31st International Conference on Very Large Scale Integration (VLSI SoC)
The purpose of VLSI SoC is to provide a forum to exchange ideas and showcase academic as well as industrial research in architectures, circuits, devices, design automation, verification, test, and security, within digital, analog, and mixed signal systems VLSI SoC 2023 will be held under the theme Innovation for Trustworthy AI, exploring the design and optimization challenges around artificial intelligence (AI) communication systems and devices embedded systems, security, low power circuits, powered by CMOS and beyond CMOS technologies
VLSI-SoC: Design Trends
This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.* The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs. *The conference was held virtually.