Vlsi Circuits And Systems In Silicon

VLSI Circuits and Systems in Silicon

Modern VLSI Design

For Electrical Engineering and Computer Engineering courses that cover the design and technology of very large scale integrated (VLSI) circuits and systems. May also be used as a VLSI reference for professional VLSI design engineers, VLSI design managers, and VLSI CAD engineers. Modern VSLI Design provides a comprehensive “bottom-up” guide to the design of VSLI systems, from the physical design of circuits through system architecture with focus on the latest solution for system-on-chip (SOC) design. Because VSLI system designers face a variety of challenges that include high performance, interconnect delays, low power, low cost, and fast design turnaround time, successful designers must understand the entire design process. The Third Edition also provides a much more thorough discussion of hardware description languages, with introduction to both Verilog and VHDL. For that reason, this book presents the entire VSLI design process in a single volume.

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization