Vlsi Circuit Design Methodology Demystified
Download Vlsi Circuit Design Methodology Demystified PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Vlsi Circuit Design Methodology Demystified book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages.
VLSI Circuit Design Methodology Demystified
This book was written to arm engineers qualified and knowledgeable in the area of VLSI circuits with the essential knowledge they need to get into this exciting field and to help those already in it achieve a higher level of proficiency. Few people truly understand how a large chip is developed, but an understanding of the whole process is necessary to appreciate the importance of each part of it and to understand the process from concept to silicon. It will teach readers how to become better engineers through a practical approach of diagnosing and attacking real-world problems.
Intelligent Systems for Optical Networks Design: Advancing Techniques
As the increased demand for high-speed communication creates an interest in the development of optical networks, intelligent all optical networks have emerged as the next generation for reliable and fast connections. Intelligent Systems for Optical Networks Design: Advancing Techniques is a comprehensive collection of research focused on theoretical and practical aspects of intelligent methodologies as applied to real world problems. This reference source is useful for research and development engineers, scholars, and students interested in the latest development in the area of intelligent systems for optical networks design.
Electronic Packaging Science and Technology
Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.