Transmit Receive Modules For Radar And Communication Systems


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Transmit Receive Modules for Radar and Communication Systems


Transmit Receive Modules for Radar and Communication Systems

Author: Rick Sturdivant

language: en

Publisher: Artech House

Release Date: 2015-12-01


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The use of electronically scanned phased arrays is increasing in systems such as radar, wireless networks, and satellite ground terminals. An important and necessary component for these systems is the transmit receive (T/R) module, which provides the amplification and electronic beam steering that is required for proper function. This new resource presents a comprehensive overview of all design, fabrication, integration, and implementation issues associated with T/R modules for radar and communications. This book provides engineers and researchers with practical designs and 44 examples of analysis, circuits, and components used in T/R modules. It also provides a solid explanation of the theory for how T/R modules operate and how they can be optimized. In addition, this book shows how the latest technical advances in silicon germanium (SiGe) and gallium nitride (GaN) are allowing levels of performance that were previously unachievable. The book concludes with informative chapters on testing, cost considerations, and the future of next generation T/R modules.

RF and Microwave Microelectronics Packaging II


RF and Microwave Microelectronics Packaging II

Author: Ken Kuang

language: en

Publisher: Springer

Release Date: 2017-03-09


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This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Official Gazette of the United States Patent and Trademark Office


Official Gazette of the United States Patent and Trademark Office

Author: United States. Patent and Trademark Office

language: en

Publisher:

Release Date: 2000


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