The Handbook Of Integration


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The Handbook of Integration


The Handbook of Integration

Author: Daniel Zwillinger

language: en

Publisher: A K Peters/CRC Press

Release Date: 1992-11-02


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This book is a compilation of the most important and widely applicable methods for evaluating and approximating integrals. It is an indispensable time saver for engineers and scientists needing to evaluate integrals in their work. From the table of contents: - Applications of Integration - Concepts and Definitions - Exact Analytical Methods - Approximate Analytical Methods - Numerical Methods: Concepts - Numerical Methods: Techniques

The Handbook of Integration


The Handbook of Integration

Author: Daniel Zwillinger

language: en

Publisher: CRC Press

Release Date: 1992-11-02


DOWNLOAD





This book is a compilation of the most important and widely applicable methods for evaluating and approximating integrals. It is an indispensable time saver for engineers and scientists needing to evaluate integrals in their work. From the table of contents: - Applications of Integration - Concepts and Definitions - Exact Analytical Methods - Appro

Handbook of 3D Integration, Volume 1


Handbook of 3D Integration, Volume 1

Author: Philip Garrou

language: en

Publisher: John Wiley & Sons

Release Date: 2011-09-22


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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.