Systems Failure Analysis

Systems Failure Analysis

Information Systems: Failure Analysis

Although system analysis is a well established methodology, the specific application of such analysis to information systems is a relatively new endeavor. Indeed, it may be said to be still in the trial-and-error stage. In recent years, such analysis has been given impetus by the numerous accounts of information system failures, some of which have led to serious consequences -e.g., the accident at Three Mile Island, the chemical spills at Bophal, India, and at Institute, West Virginia, and the loss of the space shuttle Challenger. Analysis of the failure of the W. T. Grant Company, the third largest retail organization in the United States, indicated that improper use of the available information was a significant factor in that failure. In spite of these incidents and their widespread impact, only meager attempts have been made to develop an effective methodology for analyzing the information systems involved in such incidents. There have been no well developed guidelines for determining the causes of such events and for recommending solutions so that similar failures could be avoided. To address the need for such a methodology, the North Atlantic Treaty Organization (NATO) sponsored an Advanced Research Workshop attended by a group of 32 scientists, scholars, and expert investigators, representing a variety of disciplines and countries.

Failure Analysis

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.