Spatially Resolved Characterization Of Local Phenomena In Materials And Nanostructures Volume 738
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Spatially Resolved Characterization of Local Phenomena in Materials and Nanostructures: Volume 738
A primary driver of progress in nanoscience and technology is the continuing advances in the ability to measure structure, and particularly properties, at spatially localized scales. From the point of view of characterization, it is worth mentioning advances in the interpretation of processes in semiconductors, the ability to observe and manipulate metal, carbon and silicon nanowires and nanodots, and studies in molecular self-assembly. The papers in this book fall into two categories - those addressing classes of characterization techniques that emphasize how the combination of theoretical, experimental, and instrumentational developments lead to new capabilities in nanoscale characterization, and those focused on the use of various spatially localized approaches on a single phenomenon or materials issue. Topics include: characterization with electron optics; novel measurements of nanoscale properties; size-dependent behavior of nanoparticles; biological systems at the nanoscale; processing and properties of nanowires and heterostructures; and local phenomena in materials and microstructures.
Scanning Microscopy for Nanotechnology
Author: Weilie Zhou
language: en
Publisher: Springer Science & Business Media
Release Date: 2007-03-09
This book presents scanning electron microscopy (SEM) fundamentals and applications for nanotechnology. It includes integrated fabrication techniques using the SEM, such as e-beam and FIB, and it covers in-situ nanomanipulation of materials. The book is written by international experts from the top nano-research groups that specialize in nanomaterials characterization. The book will appeal to nanomaterials researchers, and to SEM development specialists.
Chemical-Mechanical Planarization: Volume 767
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.