Simulation Of Mechanical Deformation And Tribology Of Nano Thin Amorphous Hydrogenated Carbon A
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Simulation of Mechanical Deformation and Tribology of Nano-thin Amorphous Hydrogenated Carbon (a
Molecular dynamics computer simulations are used to study the effect of substrate temperature on microstructure of deposited amorphous hydrogenated carbon (a:CH) films. A transition from dense diamond- like films to porous graphite-like films is observed between substrate temperatures of 400 and 600 K for a deposition energy of 20 eV. The dense a:CH film grown at 300 K and 20 eV has a hardness ((approximately)50 GPa) about half that of a pure carbon (a:C) film grown under the same conditions.
Thin Films Stresses and Mechanical Properties VI
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Thin Films Stresses and Mechanical Properties VI
Author: Shefford P. Baker
language: en
Publisher: Materials Research Society
Release Date: 1996-02-11
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.