Silicon Nitride Silicon Dioxide And Emerging Dielectrics 10

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Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 10

Author: R. Ekwal Sah
language: en
Publisher: The Electrochemical Society
Release Date: 2009-05
The issue of ECS Transactions contains papers presented at the Tenth International Symposium on Silicon Nitride, Silicon Dioxide, and Alternate Emerging Dielectrics held in San Francisco on May 24-29, 2009. The papers address a very wide range of fabrication and characterization techniques, and applications of thin dielectric films in microelectronic and optoelectronic devices. More specific topics addressed by the papers include reliability, interface states, gate oxides, passivation, and dielctric breakdown.
Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 9

Author: R. Ekwal Sah
language: en
Publisher: The Electrochemical Society
Release Date: 2007
This issue of ECS Transactions contains the papers presented in the symposium on Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Emerging Dielectics held May 6-11, 2007 in Chicago. Papers were presented on deposition, characterization and applications of the dielectrics including high- and low-k dielectrics, as well as interface states, device characterization, reliabiliy and modeling.
Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 11

Author: Electrochemical society. Meeting
language: en
Publisher: The Electrochemical Society
Release Date: 2011
This issue of ECS Transactions contains the peer-reviewed full length papers of the International Symposium on Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics held May 1-6, 2011 in Montreal as a part of the 219th Meeting of The Electrochemical Society. The papers address a very diverse range of topics. In addition to the deposition and characterization of the dielectrics, more specific topics addressed by the papers include applications, device characterization and reliability, interface states, interface traps, defects, transistor and gate oxide studies, and modeling.