Semiconductor Process Reliability In Practice
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Semiconductor Process Reliability in Practice
Author: Zhenghao Gan
language: en
Publisher: McGraw Hill Professional
Release Date: 2012-10-10
Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown
Reliability Theory and Technology in Manufacturing Process
This book offers a comprehensive examination of the concept, technical framework, and progression of product reliability in the manufacturing industry. It provides in-depth insights into the theories and technologies surrounding reliability analysis and optimization in manufacturing, including both mechanical and electronic component manufacturing and assembly processes. With a practical focus, the book features real-world case studies from the industry to illustrate the theories and concepts presented. The book also includes clear tables and presentations to help readers compare various methods and understand the technical systems involved in analyzing, improving, and controlling reliability in the manufacturing process. The authors have developed new tools to address reliability challenges in the production process and provide a comprehensive theoretical and methodological foundation to guide reliability analysis and optimization. The book is aimed at professional researchers, engineering executives, and personnel, as well as design and production technicians in the fields of quality and reliability engineering. It also serves as a useful reference for technicians and scholars working on solving reliability problems and enhancing quality in the manufacturing industry.
Semiconductor Advanced Packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.