Resilient Hybrid Electronics For Extreme Harsh Environments
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Resilient Hybrid Electronics for Extreme/Harsh Environments
The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.
Fast Charging and Resilient Transportation Infrastructures in Smart Cities
This book provides readers with expert knowledge on the design of fast charging infrastructures and their planning in smart cities and communities to support autonomous transportation. The recent development of fast charging infrastructures using hybrid energy systems is examined, along with aspects of connected and autonomous vehicles (CAV) and their integration within transportation networks and city infrastructures. The book looks at challenges and opportunities for autonomous transportation, including connected and autonomous vehicles, shuttles, and their technology development and deployment within smart communities. Intelligent control strategies, architectures, and systems are also covered, along with intelligent data centers that ensure effective transportation networks during normal and emergency situations. Planning strategies are presented to demonstrate the resilient transportation infrastructures, and optimized performance is discussed in view of performance indicators and requirements specifications, as well as regulations and standards.
Innovations in Electrical and Electronics Engineering
This book features selected high-quality papers presented at the 2024 International Conference on Electrical and Electronics Engineering (ICEEE 2024), jointly organized by ADSRS Education and Research and Swinburne University of Technology, Melbourne, Australia, during September 11–12, 2024, at Advanced Technologies Centre, Swinburne University of Technology, 427-451 Burwood Rd, Hawthorn VIC 3122. The book covers electrical engineering topics–power and energy including renewable energy, power electronics and applications, control, and automation and instrumentation, and book two covers the areas of robotics, artificial intelligence and IoT, electronics devices, circuits and systems, wireless and optical communication, RF and microwaves, VLSI, and signal processing, and others. The book brings both single- and multidisciplinary research on these topics to provide the most up-to-date information in one place. The book offers an asset for researchers from both academia and industries involved in advanced studies.