Proceedings Of The Symposia On Reliability Of Semiconductor Devices And Interconnection And Multilevel Metallization Interconnection And Contact Technologies
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Proceedings of the Symposia on Reliability of Semiconductor Devices/interconnections and Dielectric Breakdown, and Laser Process for Microelectronic Applications
Author: Electrochemical Society. Dielectric Science and Technology Division
language: en
Publisher: The Electrochemical Society
Release Date: 1992
Papers in this volume are from the 180th ECS Meeting, held in held in Phoenix, Arizona, Fall 1991. This symposium addresses all aspects of reliability of semiconductor devices, multilevel interconnection and dielectric breakdown in VLSI and ULSI technologies. The symposium establishes reliability from design through manufacturing. The second part of the symposium addresses laser ablation/etching, laser planarization laser/UV. CVD of metal end dielectric films, laser/UV enhanced etching and deposition processesing liquid phase, and photomodification of surfaces.