Proceedings Of The International Symposium On The Physical Failure Analysis Of Integrated Circuits
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ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author: ASM International
language: en
Publisher: ASM International
Release Date: 2019-12-01
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Proceedings of the 2001 8th International Symposium on the Physical & Failure Analysis of Integrated Circuits : IPFA 2001
Author: Wilson Tan
language: en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date: 2001
This volume contains the conference proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits.