Physical And Technical Problems Of Soi Structures And Devices

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Physical and Technical Problems of SOI Structures and Devices

Author: J.-P. Colinge
language: en
Publisher: Springer Science & Business Media
Release Date: 2012-12-06
In Physical and Technical Problems of SOI Structures and Devices, specialists in silicon-on-insulator technology from both East and West meet for the first time, giving the reader the chance to become acquainted with work from the former Soviet Union, hitherto only available in Russian and barely available to western scientists. Keynote lectures and state-of-the-art presentations give a wide-ranging panorama of the challenges posed by SOI materials and devices, material fabrication techniques, characterisation, device and circuit issues.
Silicon-on-Insulator Technology and Devices X

Author: Electrochemical Society. Electronics Division
language: en
Publisher: The Electrochemical Society
Release Date: 2001
Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment

Author: Denis Flandre
language: en
Publisher: Springer Science & Business Media
Release Date: 2006-05-06
This proceedings volume archives the contributions of the speakers who attended the NATO Advanced Research Workshop on “Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment” held at the Sanatorium Puscha Ozerna, th th Kyiv, Ukraine, from 25 to 29 April 2004. The semiconductor industry has maintained a very rapid growth during the last three decades through impressive technological achievements which have resulted in products with higher performance and lower cost per function. After many years of development semiconductor-on-insulator materials have entered volume production and will increasingly be used by the manufacturing industry. The wider use of semiconductor (especially silicon) on insulator materials will not only enable the benefits of these materials to be further demonstrated but, also, will drive down the cost of substrates which, in turn, will stimulate the development of other novel devices and applications. In itself this trend will encourage the promotion of the skills and ideas generated by researchers in the Former Soviet Union and Eastern Europe and their incorporation in future collaborations.