Minimum Number Of Timing Signoff Corners
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Minimum Number of Timing Signoff Corners
Author: Alexander Tetelbaum
language: en
Publisher: Alexander Tetelbaum
Release Date: 2024-05-09
This unique book outlines a brand-new approach of how to do timing signoff of complex microchips with the minimum number of corners. It is the first book in my planned series of books on global and local on-chip variations (OCV) and statistical, Monte-Carlo-based methods of timing signoff. I have spent more than 7 years on developing those new methods and now will share my results with the electronic design community. Each book will have a short version as a E-book that will be followed by a paperback/cover full version book with all important details. The books are mainly targeting microchip designers and software engineers in Electronic Design Automation (EDA) companies as well as companies that design and/or manufacture microchips. The number of timing signoff corners exponentially grows and makes microchip design very complex, time consuming, or even impossible to close timing. Additionally, there is a toll on microchip performance due to conservatism, which increases with the corner number. All delay, dimension, and other absolute values are scaled (or normalized) and do not represent real values/parameters of any particular technology node or design. Initially, I focus on factors impacting the corner number and how to find the minimum number of traditional Power, Voltage, Temperature (PVT), and Resistance, Capacitance (RC) corners. Then, I outline a break-through method with the absolute minimum of the corner number where instead of PVT/RC corners I introduce 4 min/max timing delay corners (so-called slack corners). Then, I discuss a new approach on how to design for the maximum profit by setting a proper target for the timing yield Y during timing signoff. Finally, I discuss possible enhancements in signoff paradigms, methods, and statistical STA tools. The importance of these pseudo- and fully statistical Monte Carlo-based post-STA methods is to study OCV variations in detail and justify all OCV derates for STA tools no matter whether the PVT/RC corners signoff is or the 4-slack corners is used.
AI-Enabled Electronic Circuit and System Design
As our world becomes increasingly digital, electronics underpin nearly every industry. Understanding how AI enhances this foundational technology can unlock innovations, from smarter homes to more powerful gadgets, offering vast opportunities for businesses and consumers alike. This book demystifies how AI streamlines the creation of electronic systems, making them smarter and more efficient. With AI’s transformative impact on various engineering fields, this resource provides an up-to-date exploration of these advancements, authored by experts actively engaged in this dynamic field. Stay ahead in the rapidly evolving landscape of AI in engineering with “AI-Enabled Electronic Circuit and System Design: From Ideation to Utilization,” your essential guide to the future of electronic systems. !--[endif]--A transformative guide describing how revolutionizes electronic design through AI integration. Highlighting trends, challenges and opportunities; Demystifies complex AI applications in electronic design for practical use; Leading insights, authored by top experts actively engaged in the field; Offers a current, relevant exploration of significant topics in AI’s role in electronic circuit and system design. Editor’s bios. Dr. Ali A. Iranmanesh is the founder and CEO of Silicon Valley Polytechnic Institute. He has received his Bachelor of Science in Electrical Engineering from Sharif University of Technology (SUT), Tehran, Iran, and both his master’s and Ph.D. degrees in Electrical Engineering and Physics from Stanford University in Stanford, CA. He additionally holds a master’s degree in business administration (MBA) from San Jose State University in San Jose, CA. Dr. Iranmanesh is the founder and chairman of the International Society for Quality Electronic Design (ISQED). Currently, he serves as the CEO of Innovotek. Dr. Iranmanesh has been instrumental in advancing semiconductor technologies, innovative design methodologies, and engineering education. He holds nearly 100 US and international patents, reflecting his signifi cant contributions to the field. Dr. Iranmanesh is the Senior life members of EEE, senior member of the American Society for Quality, co-founder and Chair Emeritus of the IEEE Education Society of Silicon Valley, Vice Chair Emeritus of the IEEE PV chapter, and recipient of IEEE Outstanding Educator Award. Dr. Hossein Sayadi is a Tenure-Track Assistant Professor and Associate Chair in the Department of Computer Engineering and Computer Science at California State University, Long Beach (CSULB). He earned his Ph.D. in Electrical and Computer Engineering from George Mason University in Fairfax, Virginia, and an M.Sc. in Computer Engineering from Sharif University of Technology in Tehran, Iran. As a recognized researcher with over 14 years of research experience, Dr. Sayadi is the founder and director of the Intelligent, Secure, and Energy-Efficient Computing (iSEC) Lab at CSULB. His research focuses on advancing hardware security and trust, AI and machine learning, cybersecurity, and energy-efficient computing, addressing critical challenges in modern computing and cyber-physical systems. He has authored over 75 peer-reviewed publications in leading conferences and journals. Dr. Sayadi is the CSU STEM-NET Faculty Fellow, with his research supported by multiple National Science Foundation (NSF) grants and awards from CSULB and the CSU Chancellor’s Office. He has contributed to various international conferences as an organizer and program committee member, including as the TPC Chair for the 2024 and 2025 IEEE ISQED.
Emerging Technologies and Circuits
Author: Amara Amara
language: en
Publisher: Springer Science & Business Media
Release Date: 2010-09-28
Emerging Technologies and Circuits contains a set of outstanding papers, keynote and tutorials presented during 3 days at the International Conference On Integrated Circuit Design and Technology (ICICDT) held in June 2008 in Minatec, Grenoble.