Materials Science Of High Temperature Polymers For Microelectronics


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Materials Science of High Temperature Polymers for Microelectronics: Volume 227


Materials Science of High Temperature Polymers for Microelectronics: Volume 227

Author: D. T. Grubb

language: en

Publisher:

Release Date: 1991


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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Materials Science of High Temperature Polymers for Microelectronics:


Materials Science of High Temperature Polymers for Microelectronics:

Author: D. T. Grubb

language: en

Publisher: Cambridge University Press

Release Date: 2014-06-05


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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Advanced Polyimide Materials


Advanced Polyimide Materials

Author: Shi-Yong Yang

language: en

Publisher: Elsevier

Release Date: 2018-04-20


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Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared


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