Materials Reliability Issues In Microelectronics Volume 225
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Materials Reliability Issues in Microelectronics: Volume 225
With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation. Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.
Materials Reliability in Microelectronics II: Volume 265
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials Reliability Issues in Microelectronics
Proceedings of the "MRS Symposium on Materials Reliability Issues in Microelectronics"--Dedication, p. xiii.