Materials Reliability In Microelectronics Vii Volume 473

Materials Reliability in Microelectronics VII: Volume 473

The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.

Materials Reliability in Microelectronics

Materials Science of the Cell: Volume 489

The 34 papers investigate the processing routes and properties of the complex molecular and macromolecular structures that hold biological cells together, both to reveal some of the mysteries of cell function and to identify natural solutions for optimizing membranes that might be adapted for applications in materials science. They cover the mechanics of DNA; the cytoskeleton, semiflexible polymers, polyelectrolytes, and motor proteins; properties and models of membranes and their interactions with macromolecules; biomaterials; and cells and cellular processes. Annotation copyrighted by Book News, Inc., Portland, OR