Massiv Parallele Und Grossskalige Phasenfeldsimulationen Zur Untersuchung Der Mikrostrukturentwicklung
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Massiv-parallele und grossskalige Phasenfeldsimulationen zur Untersuchung der Mikrostrukturentwicklung
Author: Hoetzer, Johannes
language: de
Publisher: KIT Scientific Publishing
Release Date: 2017-12-18
The development of tailored materials with defined properties requires a deep understanding of the microstructure evolution. In the first part, the microstructure evolution during the directional solidification of ternary eutectics with a highly optimized phase-field solver in the waLBerla-framework is studied. In the second part, the microstructure evolution under the influence of pores at the grain boundaries in the final sintering stage is analyzed with the PACE3D solver.
Structure evolution in tribological interfaces studied by multilayer model alloys
Author: Cihan, Ebru
language: en
Publisher: KIT Scientific Publishing
Release Date: 2020-10-21
Recent studies of deformation mechanisms of metals and alloys pioneer the better investigation of the friction and wear behavior of materials with well-defined initial microstructures. Within this scope, in this work, the effect of sub-surface deformations on the resulting friction and wear behavior has been searched by means of a systematic experimental study on Au-Ni metallic multilayer model alloy system.
Multiscale Modeling of Curing and Crack Propagation in Fiber-Reinforced Thermosets
Author: Schöller, Lukas
language: en
Publisher: KIT Scientific Publishing
Release Date: 2024-03-15
During the production of fiber-reinforced thermosets, the resin material undergoes a reaction that can lead to damage. A two-stage polymerization reaction is modeled using molecular dynamics and evaluations of the system including a fiber surface are performed. In addition, a phase-field model for crack propagation in heterogeneous systems is derived. This model is able to predict crack growth where established models fail. Finally, the model is used to predict crack formation during curing.