Managing Power Electronics
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Managing Power Electronics
Author: Nazzareno Rossetti
language: en
Publisher: John Wiley & Sons
Release Date: 2005-12-30
A unique system focus that presents specific solutions for specific appliances This publication presents state-of-the-art power management techniques for modern electronic appliances that rely on such very large-scale integration (VLSI) chips as CPUs and DSPs. The author thoroughly covers all aspects of the field, including semiconductor manufacturing processes, packages, circuits, functions, and systems. A unique and significant contribution to the field, the publication adopts a "system focus" by first presenting the appliance and then delving into the power management architecture and topologies that best serve each appliance. In addition to specific techniques and applications, the publication discusses fundamental physical and socioeconomic issues. For example, the author examines Moore's law and its effect on power management and heat dissipation, which points to a future breakthrough needed to continue the fast pace of advancement in the high-tech industry. The author provides a solid technical foundation and an analysis of popular electronic appliances, including: * Overview of the semiconductor industry * Plain-English discussion of semiconductor processes and packages * Step-by-step guide to analog design building from the transistor to higher-level functions, leading to the implementation of a complete voltage regulator * Popular DC-DC voltage regulation architectures * AC-DC architectures for power conversion * Ultra-portable devices, such as cellular phones, PDAs, and digital still cameras * Desktop and notebook PCs The publication concludes with a chapter on special power management topics and an expert forecast of future directions for the field. This is essential reading for researchers, engineers, and designers in the semiconductor and integrated circuits industries. With its extensive use of cross-section drawings as well as transistor circuit schematics, this is also a recommended textbook for advanced undergraduate and graduate courses in computer science and electrical engineering.
Fundamentals of Power Electronics
"Fundamentals of Power Electronics" offers a comprehensive exploration of principles, applications, and advancements in power electronics. We provide a valuable resource for students, engineers, and researchers to understand the fundamental concepts and practical aspects of power electronic systems. We cover a wide range of topics, including semiconductor devices, power electronic converters, control techniques, and applications in renewable energy, electric vehicles, and industrial systems. Complex concepts are presented clearly and accessibly, with step-by-step explanations, illustrative examples, and detailed diagrams to aid comprehension. Real-world examples and case studies demonstrate the application of power electronics in various industries, offering insights into design considerations, performance optimization, and troubleshooting techniques. Each chapter is structured to facilitate learning, with learning objectives, summaries, review questions, and problem-solving exercises to reinforce understanding and retention of key concepts. The book incorporates the latest advancements in power electronics technology, including wide bandgap semiconductors, digital control techniques, and emerging applications such as wireless power transfer and Internet of Things (IoT) devices. "Fundamentals of Power Electronics" is an essential guide for mastering power electronics and its applications in today's technological landscape.
Power Electronic Packaging
Author: Yong Liu
language: en
Publisher: Springer Science & Business Media
Release Date: 2012-02-15
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.