Liquid Metal Soft Machines


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Liquid Metal Soft Machines


Liquid Metal Soft Machines

Author: Jing Liu

language: en

Publisher: Springer

Release Date: 2018-09-19


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This book discusses the core principles and practical applications of a brand new machine category: liquid-metal soft machines and motors. After a brief introduction on the conventional soft robot and its allied materials, it presents the new conceptual liquid-metal machine, which revolutionizes existing rigid robots, both large and small. It outlines the typical features of the soft liquid-metal materials and describes the various transformation capabilities, mergence of separate metal droplets, self-rotation and planar locomotion of liquid-metal objects under external or internal mechanism. Further, it introduces a series of unusual phenomena discovered while developing the shape changeable smart soft machine and interprets the related mechanisms regarding the effects of the shape, size, voltage, orientation and geometries of the external fields to control the liquid-metal transformers. Moreover, the book illustrates typical strategies to construct a group of different advanced functional liquid-metal soft machines, since such machines or robots are hard to fabricate using rigid-metal or conventional materials. With highly significant fundamental and practical findings, this book is intended for researchers interested in establishing a general method for making future smart soft machine and accompanying robots.

Handbook of Liquid Metals


Handbook of Liquid Metals

Author: Jing Liu

language: en

Publisher: Springer Nature

Release Date: 2024-10-29


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This handbook systematically collects the latest scientific and technological knowledge on liquid metals obtained so far in this cutting edge frontier. Conventional materials such as metals, polymers, composites, ceramics and naturally derived matters, may not perform well when facing certain technological challenges. At around room temperature, most of such materials mainly stay at solid state and are often difficult to shape due to their high melting point. Meanwhile, although classical soft matters own good flexibility, their electrical conductivities including more behaviours appear not good enough which generally limited their utilizations. As a game-changing alternative, the room temperature liquid metal materials are quickly emerging as a new generation functional material which displayed many unconventional properties superior to traditional materials. Their outstanding versatile feature as “One material, diverse capabilities” is rather unique among existing materials and thus opens many exciting opportunities for scientific, technological and industrial developments. This handbook presents comprehensive reference information on liquid metal science and technology that are currently available. The major advancements as made before are collected and summarized. Representative liquid metal applications are illustrated. It helps readers obtain a comprehensive understanding of the technical progresses and fundamental discoveries in the frontier, and thus better explore and utilize liquid metal materials to address various challenging needs.

Advanced Liquid Metal Cooling For Chip, Device And System


Advanced Liquid Metal Cooling For Chip, Device And System

Author: Jing Liu

language: en

Publisher: World Scientific

Release Date: 2022-04-08


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This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.