Light Extraction From Gan Based Light Emitting Diodes With A Noninvasive Two Dimensional Photonic Crystal
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Light Extraction from GaN-based Light Emitting Diodes with a Noninvasive Two-dimensional Photonic Crystal
A noninvasive fabrication process involving soft nanoimprint lithography is used to pattern a photonic crystal (PhC) in titania film for enhanced light extraction from a GaN light emitting diode (LED). This technique avoids damaging the LED structure by the etching process, while photoluminescence measurements show extracted modes emitted from the quantum wells which agree well with modeling. A light extraction improvement of 1.8 times is measured using this noninvasive PhC. Contacts are made on the LED structure without PhC. The device works properly and shows good electrical properties. A drop in the external quantum efficiency is observed under high forward bias and is attributed to Auger recombination processes.
LED Packaging for Lighting Applications
Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led
Handbook of Optical Microcavities
An optical cavity confines light within its structure and constitutes an integral part of a laser device. Unlike traditional gas lasers, semiconductor lasers are invariably much smaller in dimensions, making optical confinement more critical than ever. In this book, modern methods that control and manipulate light at the micrometer and nanometer scales by using a variety of cavity geometries and demonstrate optical resonance from ultra-violet (UV) to infra-red (IR) bands across multiple material platforms are explored. The book has a comprehensive collection of chapters that cover a wide range of topics pertaining to resonance in optical cavities and are contributed by leading researchers in the field. The topics include theory, design, simulation, fabrication, and characterization of micrometer- and nanometer-scale structures and devices that support cavity resonance via various mechanisms such as Fabry–Pérot, whispering gallery, photonic bandgap, and plasmonic modes. The chapters discuss optical cavities that resonate from UV to IR wavelengths and are based on prominent III-V material systems, including Al, In, and Ga nitrides, ZnO, and GaAs.