Lcp For Microwave Packages And Modules


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LCP for Microwave Packages and Modules


LCP for Microwave Packages and Modules

Author: Anh-Vu H. Pham

language: en

Publisher: Cambridge University Press

Release Date: 2012-06-21


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A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP) at package, component and system levels, providing a detailed look at everything you need to know to get up-to-speed on the subject, including successful design details, techniques and potential pitfalls.

LCP for Microwave Packages and Modules


LCP for Microwave Packages and Modules

Author:

language: en

Publisher:

Release Date: 2012


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A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.

High-Frequency Integrated Circuits


High-Frequency Integrated Circuits

Author: Sorin Voinigescu

language: en

Publisher: Cambridge University Press

Release Date: 2013-02-28


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A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave and optical fiber circuits using nanoscale CMOS, SiGe BiCMOS and III-V technologies. Step-by-step design methodologies, end-of-chapter problems and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.