Introduction To System Design Using Integrated Circuits
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Introduction to System Design Using Integrated Circuits
Beginning With An Introduction To Integrated Electronics, The Book Describes The Basic Digital And Linear Ics In Detail Together With Some Applications And Building Blocks Of Digital Systems. Principles Of System Design Using Ics Are Then Explained And A Number Of System Design Examples Using The Latest Ics Are Worked Out. Useful Supplementary Information On Ics Is Included In The Appendices And A List Of References To Published Work Is Given At The End. The Book Covers What Is Latest In The State-Of-The-Art In Ics Including Ls T Tl, F Ttl, N-Mos, High-Speed Cmos, I2L, Ccds, Proms, Plas, Asics And Microprocessors. The Main Emphasis Here Is On Providing A Clear Insight Into The Characteristics And Limitations Of Ics Upto Lsi/Vlsi Level, Their Parameters, Circuit Features And Electronic Equipment/System Design Based On Them. Students Of The B.E./M.E./M.Sc (Physics) Courses Specializing In Electronics Or Communication Engineering Would Find This Book A Convenient Text/Reference Source For A First In-Depth Understanding Of System Design Using Ics. The Book Would Also Be Useful To R&D Engineers In Electronics/Communication Engineering.
Three-Dimensional Integrated Circuit Design
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Ultra-Low Power Integrated Circuit Design
Author: Nianxiong Nick Tan
language: en
Publisher: Springer Science & Business Media
Release Date: 2013-10-23
This book describes the design of CMOS circuits for ultra-low power consumption including analog, radio frequency (RF), and digital signal processing circuits (DSP). The book addresses issues from circuit and system design to production design, and applies the ultra-low power circuits described to systems for digital hearing aids and capsule endoscope devices. Provides a valuable introduction to ultra-low power circuit design, aimed at practicing design engineers; Describes all key building blocks of ultra-low power circuits, from a systems perspective; Applies circuits and systems described to real product examples such as hearing aids and capsule endoscopes.