Introduction To Microsystem Technology
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Introduction to Microsystem Technology
Over half a century after the discovery of the piezoresistive effect, microsystem technology has experienced considerable developments. Expanding the opportunities of microelectronics to non-electronic systems, its number of application fields continues to increase. Microsensors are one of the most important fields, used in medical applications and micromechanics. Microfluidic systems are also a significant area, most commonly used in ink-jet printer heads. This textbook focuses on the essentials of microsystems technology, providing a knowledgeable grounding and a clear path through this well-established scientific dicipline. With a methodical, student-orientated approach, Introduction to Microsystem Technology covers the following: microsystem materials (including silicon, polymers and thin films), and the scaling effects of going micro; fabrication techniques based on different material properties, descriptions of their limitations and functional and shape elements produced by these techniques; sensors and actuators based on elements such as mechanical, fluidic, and thermal (yaw rate sensor components are described); the influence of technology parameters on microsystem properties, asking, for example, when is the function of a microsystem device robust and safe? The book presents problems at the end of each chapter so that you may test your understanding of the key concepts (full solutions for these are given on an accompanying website). Practical examples are included also, as well as case studies that enable a better understanding of the technology as a whole. With its extensive treatment on the fundamentals of microsystem technology, this book also serves as a compendium for engineers and technicians working with microsystem technology.
Introduction to Microsystem Packaging Technology
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Microsystem Technology
This completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating.