Iec 60068 Part 2 27 Pdf
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GB 3836.3-2010 English Translation of Chinese Standard
Author: https://www.codeofchina.com
language: en
Publisher: https://www.codeofchina.com
Release Date:
This part of GB 3836 specifies the requirements for the design, construction, testing and marking of electrical apparatus with type of protection increased safety "e" intended for use in explosive gas atmospheres. This standard applies to electrical apparatus where the rated voltage does not exceed 11 kV r.m.s. a.c. or d.c. Additional measures are applied to ensure that the apparatus does not produce arcs, sparks, or excessive temperatures in normal operation or under specified abnormal conditions. This standard supplements and modifies the general requirements of GB 3836.1-2010. Where a requirement of this standard conflicts with a requirement of GB 3836.1-2010, the requirement of this standard takes precedence.
The Performance of Concentrated Solar Power (CSP) Systems
The Performance of Concentrated Solar Power (CSP) Systems: Analysis, Measurement, and Assessment offers a unique overview of the information on the state-of-the-art of analysis, measurement, and assessment of the performance of concentrated solar power (CSP) components and systems in a comprehensive, compact, and complete manner. Following an introductory chapter to CSP systems and the fundamental principles of performance assessment, individual chapters explore the component performance of mirrors and receivers. Further expert-written chapters look at system performance assessment, durability testing, and solar resource forecasting for CSP systems. A final chapter gives an outlook on the actual methods and instruments for performance and durability assessment that are underdevelopment. The Performance of Concentrated Solar Power (CSP) Systems: Analysis, Measurement, and Assessment is an essential reference text for research and development professionals and engineers working on concentrated solar power systems, as well as for postgraduate students studying CSP. - Presents a unique, single literature source for a complete overview of the performance assessment tools and methods currently used for concentrated solar power (CSP) technology - Written by a team of experts in the field of CSP - Provides information on the state-of-the-art of modeling, measurement, and assessment of the performance of CSP components and systems in a comprehensive, compact, and complete manner
Mitigating Tin Whisker Risks
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.