High Speed Interconnects In Vlsi Design Modeling And Signal Integrity
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High-Speed Interconnects in VLSI Design, Modeling, and Signal Integrity
The rapid advancement in VLSI (Very-Large-Scale Integration) technology has ushered in a new era of high-performance systems, where interconnects have become a critical bottleneck in determining speed, power, and reliability. This textbook provides a comprehensive understanding of high-speed interconnect design, analytical and simulation-based modeling techniques, and signal integrity challenges in modern integrated circuits. It is intended for graduate students, researchers, and industry professionals involved in IC design and signal integrity analysis.
Compact Models and Measurement Techniques for High-Speed Interconnects
Author: Rohit Sharma
language: en
Publisher: Springer Science & Business Media
Release Date: 2012-02-17
Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Compact Models and Performance Investigations for Subthreshold Interconnects
The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.