High Cycle Fatigue Of Al And Cu Thin Films By A Novel High Throughput Method
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High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
Author: Sofie Burger
language: en
Publisher: KIT Scientific Publishing
Release Date: 2014-05-19
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.
Respect for Persons
Originally published in 1969, this book provides a sustained examination of the idea of the individual person as of supreme worth in the language of analytical philosophy. An important contribution to debates in moral philosophy, it will be of use to students in the philosophy of religion and education and to those who are interested in the contribution which philosophical analysis can make to the understanding of traditional moral and political ideas.
A novel micro-mechanical model for prediction of multiaxial high cycle fatigue at small scales
Author: Eslami, Reza
language: en
Publisher: KIT Scientific Publishing
Release Date: 2017-05-03
The grain microstructure and damage mechanisms at the grain level are the key factors that influence fatigue of metals at small scales. This is addressed in this work by establishing a new micro-mechanical model for prediction of multiaxial high cycle fatigue (HCF) at a length scale of 5-100?m. The HCF model considers elasto-plastic behavior of metals at the grain level and microstructural parameters, specifically the grain size and the grain orientation.