Hermeticity Testing Of Mems And Microelectronic Packages
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Hermeticity Testing of MEMS and Microelectronic Packages
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.
Hermeticity Testing of MEMS and Microelectronic Packages
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in.
Advanced RF MEMS
Author: Stepan Lucyszyn
language: en
Publisher: Cambridge University Press
Release Date: 2010-08-19
An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation