Failure Modes And Mechanisms In Electronic Packages
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Failure Modes and Mechanisms in Electronic Packages
Author: P. Singh
language: en
Publisher: Springer Science & Business Media
Release Date: 2012-12-06
Those of us who grew up in the "through-hole" age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of "the chip. " Much attention is focussed on the silicon and on the marvelous production and entertainment tools we now see in our offices and homes. Between the silicon and the end product lies the less publicized world of circuit-level packaging. We leave it to a cadre of technologists to take the schematics and parts lists and to develop the processes that tum the designers' concepts into physical reality. And while the silicon transistor is shrinking, the engineering challenges of packaging multiple chips and associated components into increasingly dense subsystems are growing. Further, the transistor may have to function without failure through severe industrial or military environments over the lifetime of the product.
Failure Modes and Mechanisms in Electronic Packages
Author: P. Singh
language: en
Publisher: Springer Science & Business Media
Release Date: 1997-11-30
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Reliability and Failure of Electronic Materials and Devices
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites