Electrotechnical Materials From Microstructure Foundation To Smart Applications
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ELECTROTECHNICAL MATERIALS: FROM MICROSTRUCTURE FOUNDATION TO SMART APPLICATIONS
This book contains discussions about, Electrotechnical Materials: Microstructure Foundations to Smart Applications. Introduction to Electrotechnical Materials, Atomic Structure and Interatomic Bonding, Crystal Structure and Microstructure, Conductor Materials, Insulator and Dielectric Materials, Semiconductor Materials, Magnetic Materials, Superconductor Materials, Material Characterization Techniques, Material Manufacturing and Modification Processes, Material Applications in Electrotechnical Devices, Materials for Renewable Energy and Smart Electronics, Future of Electrotechnical Materials.
Smart and Multifunctional Concrete Toward Sustainable Infrastructures
This book presents the latest research advances and findings in the field of smart/multifunctional concretes, focusing on the principles, design and fabrication, test and characterization, performance and mechanism, and their applications in infrastructures. It also discusses future challenges in the development and application of smart/multifunctional concretes, providing useful theory, ideas and principles, as well as insights and practical guidance for developing sustainable infrastructures. It is a valuable resource for researchers, scientists and engineers in the field of civil-engineering materials and infrastructures.
Power Electronic Packaging
Author: Yong Liu
language: en
Publisher: Springer Science & Business Media
Release Date: 2012-02-15
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.