Electrochemical Processing In Ulsi And Mems 4

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Electrochemical Processing in ULSI and MEMS 4

Author: T. P. Moffat
language: en
Publisher: The Electrochemical Society
Release Date: 2009-10
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Electrochemical Processing in ULSI and MEMS 4¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, CA from May 24 to 29, 2009.
Electrochemical Processing in ULSI and MEMS 3

Author: John O. Dukovic
language: en
Publisher: The Electrochemical Society
Release Date: 2007-09
The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.
Electrochemical Processes in ULSI and MEMS

Author: Hariklia Deligianni
language: en
Publisher: The Electrochemical Society
Release Date: 2005