Drivere

Algorithms and Architectures for Parallel Processing

The three volume set LNCS 13155, 13156, and 13157 constitutes the refereed proceedings of the 21st International Conference on Algorithms and Architectures for Parallel Processing, ICA3PP 2021, which was held online during December 3-5, 2021. The total of 145 full papers included in these proceedings were carefully reviewed and selected from 403 submissions. They cover the many dimensions of parallel algorithms and architectures including fundamental theoretical approaches, practical experimental projects, and commercial components and systems. The papers were organized in topical sections as follows: Part I, LNCS 13155: Deep learning models and applications; software systems and efficient algorithms; edge computing and edge intelligence; service dependability and security algorithms; data science; Part II, LNCS 13156: Software systems and efficient algorithms; parallel and distributed algorithms and applications; data science; edge computing and edge intelligence; blockchain systems; deept learning models and applications; IoT; Part III, LNCS 13157: Blockchain systems; data science; distributed and network-based computing; edge computing and edge intelligence; service dependability and security algorithms; software systems and efficient algorithms.

Systems Modeling and Simulation: Theory and Applications

This book constitutes the refereed post-proceedings of the third Asian Simulation Conference, AsiaSim 2004, held in Jeju Island, Korea in October 2004. The 78 revised full papers presented together with 2 invited keynote papers were carefully reviewed and selected from 178 submissions; after the conference, the papers went through another round of revision. The papers are organized in topical sections on modeling and simulation methodology, manufacturing, aerospace simulation, military simulation, medical simulation, general applications, network simulation and modeling, e-business simulation, numerical simulation, traffic simulation, transportation, virtual reality, engineering applications, and DEVS modeling and simulation.

Specifications and Drawings of Patents Issued from the United States Patent Office