Development And Characterization Of A Dispersion Encoded Method For Low Coherence Interferometry

Development and Characterization of a Dispersion-Encoded Method for Low-Coherence Interferometry

Development and Characterization of a Dispersion-Encoded Method for Low-Coherence Interferometry

This Open Access book discusses an extension to low-coherence interferometry by dispersion-encoding. The approach is theoretically designed and implemented for applications such as surface profilometry, polymeric cross-linking estimation and the determination of thin-film layer thicknesses. During a characterization, it was shown that an axial measurement range of 79.91 μm with an axial resolution of 0.1 nm is achievable. Simultaneously, profiles of up to 1.5 mm in length were obtained in a scan-free manner. This marked a significant improvement in relation to the state-of-the-art in terms of dynamic range. Also, the axial and lateral measurement range were decoupled partially while functional parameters such as surface roughness were estimated. The characterization of the degree of polymeric cross-linking was performed as a function of the refractive index. It was acquired in a spatially-resolved manner with a resolution of 3.36 x 10-5. This was achieved by the development of a novel mathematical analysis approach.

Recent Advances in Microelectronics Reliability

This book describes the latest progress in reliability analysis of microelectronic products. The content grows out of an EU project, named Intelligent Reliability 4.0 - iRel40 (see www.irel40.eu ). Different industrial sectors and topics are covered, such as electronics in automotive, rail transport, lighting and personal appliances. Several case studies and examples are discussed, which will enable readers to assess and mitigate similar failure cases. More importantly, this book tries to present methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of electronic devices.