Crack Growth In Concrete Using Boundary Elements

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Crack Growth in Concrete Using Boundary Elements

Author: Abd. Latif Saleh
language: en
Publisher: Computational Mechanics
Release Date: 1997
Thermomechanical Crack Growth Using Boundary Elements

Thermal and mechanical fatigue problems are encountered in many engineering components, such as pressure vessels, high temperature vessels, high temperature engines and interfaces in computer technology. This book describes the modelling of thermal fatigue using the Dual Boundary Element Method.
Boundary Elements and Other Mesh Reduction Methods

Formed of presented papers this volume contains research from the 40th International Conference on Boundary Elements and other Mesh Reduction Methods, recognised as THE international forum for the latest advances in these techniques and their applications in science and engineering. The ongoing success of this series is a result of the strength of research being carried out all over the world and the coverage has continually evolved in line with the latest developments in the field. The books originating from this conference series constitute a record of the development of BEM/MRM, running from the initial successful development of boundary integral techniques into the boundary element method, a technique that eliminates the need for an internal mesh, to the recent and most sophisticated Mesh Reduction and even Meshless Methods. Since these methods are used in many engineering and scientific fields the 2017 book, Boundary Elements and other Mesh Reduction Methods XXXX, like the series before, will be of great interest to those working within the areas of numerical analysis, boundary elements and meshless methods. The research papers included in this volume cover: Advanced formulations; Advanced meshless and mesh reduction methods; Structural mechanics applications; Solid mechanics; Heat and mass transfer; Electrical engineering and electromagnetics; Computational methods; Fluid flow modelling; Damage mechanics and fracture; Dynamics and vibrations; Engineering applications; Interfacing with other methods; Coupling with design and manufacturing; Solution of large systems of equations.