Copper Interconnects New Contact Metallurgies Structures And Low K Inter Level Dielectrics
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Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II
Author: G. S. Mathad
language: en
Publisher: The Electrochemical Society
Release Date: 2003
Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics
Author: G. Mathad
language: en
Publisher: The Electrochemical Society
Release Date: 2009-03
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Low k Inter-Level Metal Dielectrics and New Contact and Barrier Metallurgies/Structures¿, held during the PRiME 2008 joint international meeting of The Electrochemical Society and The Electrochemical Society of Japan, with the technical cosponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry. This meeting was held in Honolulu, Hawaii, from October 12 to 17, 2008.