Computational Methods For Understanding Riboswitches


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Computational Methods for Understanding Riboswitches


Computational Methods for Understanding Riboswitches

Author:

language: en

Publisher: Academic Press

Release Date: 2015-02-24


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This new volume of Methods in Enzymology continues the legacy of this premier serial with quality chapters authored by leaders in the field. This volume covers computational prediction RNA structure and dynamics, including such topics as computational modeling of RNA secondary and tertiary structures, riboswitch dynamics, and ion-RNA, ligand-RNA and DNA-RNA interactions. - Continues the legacy of this premier serial with quality chapters authored by leaders in the field - Covers computational methods and applications in RNA structure and dynamics - Contains chapters with emerging topics such as RNA structure prediction, riboswitch dynamics and thermodynamics, and effects of ions and ligands.

Computational Methods for Understanding Riboswitches


Computational Methods for Understanding Riboswitches

Author:

language: en

Publisher:

Release Date: 2015


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Recent Progress in Lead-Free Solder Technology


Recent Progress in Lead-Free Solder Technology

Author: Mohd Arif Anuar Mohd Salleh

language: en

Publisher: Springer Nature

Release Date: 2022-03-01


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This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.