Circuit Design Process


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Electronic Circuit Design


Electronic Circuit Design

Author: Nihal Kularatna

language: en

Publisher: CRC Press

Release Date: 2017-12-19


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With growing consumer demand for portability and miniaturization in electronics, design engineers must concentrate on many additional aspects in their core design. The plethora of components that must be considered requires that engineers have a concise understanding of each aspect of the design process in order to prevent bug-laden prototypes. Electronic Circuit Design allows engineers to understand the total design process and develop prototypes which require little to no debugging before release. It providesstep-by-step instruction featuring modern components, such as analog and mixed signal blocks, in each chapter. The book details every aspect of the design process from conceptualization and specification to final implementation and release. The text also demonstrates how to utilize device data sheet information and associated application notes to design an electronic system. The hybrid nature of electronic system design poses a great challenge to engineers. This book equips electronics designers with the practical knowledge and tools needed to develop problem free prototypes that are ready for release.

Fundamentals of Layout Design for Electronic Circuits


Fundamentals of Layout Design for Electronic Circuits

Author: Jens Lienig

language: en

Publisher: Springer Nature

Release Date: 2020-03-19


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This book covers the fundamental knowledge of layout design from the ground up, addressing both physical design, as generally applied to digital circuits, and analog layout. Such knowledge provides the critical awareness and insights a layout designer must possess to convert a structural description produced during circuit design into the physical layout used for IC/PCB fabrication. The book introduces the technological know-how to transform silicon into functional devices, to understand the technology for which a layout is targeted (Chap. 2). Using this core technology knowledge as the foundation, subsequent chapters delve deeper into specific constraints and aspects of physical design, such as interfaces, design rules and libraries (Chap. 3), design flows and models (Chap. 4), design steps (Chap. 5), analog design specifics (Chap. 6), and finally reliability measures (Chap. 7). Besides serving as a textbook for engineering students, this book is a foundational reference for today’s circuit designers. For Slides and Other Information: https://www.ifte.de/books/pd/index.html

Three-Dimensional Integrated Circuit Design


Three-Dimensional Integrated Circuit Design

Author: Vasilis F. Pavlidis

language: en

Publisher: Newnes

Release Date: 2017-07-04


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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization