Cad Of Circuits And Integrated Systems
Download Cad Of Circuits And Integrated Systems PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Cad Of Circuits And Integrated Systems book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages.
CAD of Circuits and Integrated Systems
This book addresses the difficulty of obtaining a quality solution, that is, pre optimal or even optimal, in a reasonable time from a central processing unit (CPU). As polynomial problems can be treated by exact methods, the problem posed concerns non-polynomial problems, for which it is necessary to develop efficient algorithms based on heuristics or meta-heuristics. Chapter 3 of this book demonstrates how to develop such algorithms, which are characterized by: an initialization of argued solutions (sometimes, the global optimum can be obtained from such an initialization); a non-random generation of solutions (to avoid generating the same solution several times, or even generating solutions that cannot be achieved); avoidance of being trapped by a local optimum; good use of CPU time by reducing the size of the space of solutions to be explored (which is often very large for such problems) without compromising the quality of the solution; plus a reasoned displacement from one solution to another, to improve the quality of the solution as the processing is carried out. These aspects are applied to concrete applications in the design of integrated circuits and systems at various levels. To do this and to help the reader better understand this problem, Chapters 1 and 2 present basic notions on computational complexity, and the design of integrated circuits and systems.
Computer-Aided Design of Analog Integrated Circuits and Systems
The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.
Design of 3D Integrated Circuits and Systems
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.