Broad Applications Of Diffusion Bonding

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Broad Applications of Diffusion Bonding

Results are presented of a study of the broad application of diffusion bonding. A comprehensive literature survey of the present status of diffusion bonding was been conducted and the information incorporated in the report. The relevant aspects of 'Diffusion Theory' was been outlined, followed by a detailed discussion of the fundamental factors governing the diffusion bonding process. The status of the process has been delineated through a presentation of the practical applications and the experimental data on diffusion bonding. Consideration has been given to the development of a logical framework for the selection of a diffusion bonding technique for new Joining applications. Areas in which further work is needed for developing the reliability of the process and broadening its applications have been described. Finally, the future potential of diffusion bonding has been reviewed by outlining the material characteristics and structures which appear to be amenable to Joining by diffusion bonding. This study will provide assistance in the selection or rejection of a diffusion bonding technique for specific Joining applications.
Joining Technologies

Author: Mahadzir Ishak
language: en
Publisher: BoD – Books on Demand
Release Date: 2016-09-21
Joining and welding are two of the most important processes in manufacturing. These technologies have vastly improved and are now extensively used in numerous industries. This book covers a wide range of topics, from arc welding (GMAW and GTAW), FSW, laser and hybrid welding, and magnetic pulse welding on metal joining to the application of joining technologies for textile products. The analysis of temperature and phase transformation is also incorporated. This book also discusses the issue of dissimilar joint between metal and ceramic, as well as the technology of diffusion bonding.
NASA Scientific and Technical Reports

Author: United States. National Aeronautics and Space Administration Scientific and Technical Information Division
language: en
Publisher:
Release Date: 1967