Bonding In Microsystem Technology Springer Series In Advanced Microelectronics
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Bonding in Microsystem Technology
Author: Jan A. Dziuban
language: en
Publisher: Springer Science & Business Media
Release Date: 2007-01-30
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
Advanced Gate Stacks for High-Mobility Semiconductors
Author: Athanasios Dimoulas
language: en
Publisher: Springer Science & Business Media
Release Date: 2008-01-01
This book provides a comprehensive monograph on gate stacks in semiconductor technology. It covers the major latest developments and basics and will be useful as a reference work for researchers, engineers and graduate students alike. The reader will get a clear view of what has been done so far, what is the state-of-the-art and which are the main challenges ahead before we come any closer to a viable Ge and III-V MOS technology.