Arbitrary Modeling Of Tsvs For 3d Integrated Circuits
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Arbitrary Modeling of TSVs for 3D Integrated Circuits
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Next Generation EDA Flow
Author: Khaled Salah Mohamed
language: en
Publisher: Springer Nature
Release Date: 2025-05-13
This book serves as a comprehensive guide to the world of EDA tools, offering readers a deeper understanding of their inner workings and a glimpse into the future of electronic design. With a meticulous focus on numerical methods, the author delves deeply into the mathematical foundations that underpin EDA tools. From finite element analysis to Monte Carlo simulations, readers will gain a thorough understanding of the numerical techniques employed to model and simulate complex electronic systems. Furthermore, this book elucidates the diverse modeling methods utilized in EDA tools, providing readers with a holistic view of the methods employed to represent and analyze electronic circuits and systems. Whether exploring circuit-level simulations or system-level modeling, readers will be equipped with the knowledge needed to navigate the intricacies of EDA toolsets. The author also delves into the fascinating intersection of quantum mechanics and electronic design, examining the evolving landscape of quantum EDA tools and offering insights into the transformative potential of quantum computing in electronic design. Lastly, this book explores the transformative impact of machine learning on EDA tools, offering insights into how artificial intelligence techniques can enhance performance and productivity.
3D Interconnect Architectures for Heterogeneous Technologies
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.