Adhesion Science And Engineering
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Adhesion Science and Engineering
The Mechanics of Adhesion shows that adhesion science and technology is inherently an interdisciplinary field, requiring fundamental understanding of mechanics, surfaces, and materials. This volume comprises 19 chapters. Starting with a background and introduction to stress transfer principles; fracture mechanics and singularities; and an energy approach to debonding, the volume continues with analysis of structural lap and butt joint configurations. It then continues with discussions of test methods for strength and constitutive properties; fracture; peel; coatings, the case of adhesion to a single substrate; elastomeric adhesives such as sealants. The role of mechanics in determining the locus of failure in bonded joints is discussed, followed by a chapter on rheology relevant to adhesives and sealants. Pressure sensitive adhesive performance; the principles of tack and tack measurements; and contact mechanics relevant to wetting and surface energy measurements are then covered. The volume concludes with sections on fibermatrix bonding and reinforcement; durability considerations for adhesive bonds; ultrasonic non-destructive evaluation of adhesive bonds; and design of adhesive bonds from a strength perspective. This book will be of interest to practitioners in the fields of engineering and to those with an interest in adhesion science.
Adhesion Science and Engineering
The Mechanics of Adhesion shows that adhesion science and technology is inherently an interdisciplinary field, requiring fundamental understanding of mechanics, surfaces, and materials. This volume comprises 19 chapters. Starting with a background and introduction to stress transfer principles; fracture mechanics and singularities; and an energy approach to debonding, the volume continues with analysis of structural lap and butt joint configurations. It then continues with discussions of test methods for strength and constitutive properties; fracture; peel; coatings, the case of adhesion to a single substrate; elastomeric adhesives such as sealants. The role of mechanics in determining the locus of failure in bonded joints is discussed, followed by a chapter on rheology relevant to adhesives and sealants. Pressure sensitive adhesive performance; the principles of tack and tack measurements; and contact mechanics relevant to wetting and surface energy measurements are then covered. The volume concludes with sections on fibermatrix bonding and reinforcement; durability considerations for adhesive bonds; ultrasonic non-destructive evaluation of adhesive bonds; and design of adhesive bonds from a strength perspective. This book will be of interest to practitioners in the fields of engineering and to those with an interest in adhesion science.
Adhesion and Adhesives
Author: Anthony J. Kinloch
language: en
Publisher: Springer Science & Business Media
Release Date: 2012-12-06
Over the last decade, or so, the growth in the use of adhesives, especially in ever more technically demanding applications, has been rapid and many major developments in the technology of adhesives have been reported. This growth has also led to attention being focused on somewhat more basic studies of the science of adhesion and adhesives, and in recent years our level of fundamental knowledge concerning the formation and mechanical performance of adhesive joints has increased dramatically. Such studies have, of course, been aided greatly by the development of the tools at the disposal of the investigators. For example, specific surface analytical techniques, such as X-ray photoelectron and secondary-ion mass spectroscopy, and the increasingly sophisticated methods of stress analysis and fracture mechanics have been put to good use in furthering our understanding of the science of adhesion and adhesives. The present book attempts to review the multidisciplined subject of adhesion and adhesives, considering both the science and technology involved in the formation and mechanical performance of adhesive joints. The author would like to thank his friends and colleagues for useful discus sions and help in the preparation of this book. I am particularly grateful to P. Cawley, J. Comyn, W. A. Lees, A. C. Roulin-Moloney, W. C. Wake, J. G. Williams and R. J. Young who have read and commented on various chapters and P. Farr for preparing the diagrams.