Adhesion In Microelectronics

Adhesion in Microelectronics

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Adhesion in Microelectronics

Progress in Adhesion and Adhesives, Volume 2

With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.